Heat Dissipating Pastes

Heat dissipating pastes are essential components for maintaining the optimal temperature of electronic devices. Designed to absorb and transfer heat generated by internal components, these pastes ensure efficient and prolonged operation of the hardware.

Technical Features

• Material: Thermal silicone, graphene or ceramic
• Thermal Conductivity: Variable range depending on the material (W/mK)
• Thickness: Available in different thicknesses to meet specific needs
• Presentation: Tubes, pre-cut pads or plates

Advantages

Improves device performance by maintaining optimal temperature.

Prevents overheating and damage to electronic components.

Increases the lifespan of the device.

Easy to apply and remove.

Applications

Heat dissipating pastes are used in a wide range of electronic devices, including:

• Processors (CPU)
• Graphics cards (GPU)
• Heatsinks
• LEDs and other heat-generating components

For more information about heat dissipating pastes and to find the right product for your needs, visit adjditec.com.