MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste
Tweet
Follow @ADJDiTec
.
Če želite cenovno ponudbo za ta izdelek, joj lahko zahtevate s klikom na spodnji gumb.
Zahtevaj cenovnike.
BP20 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal.Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.Manufacturer: Hexion
Podobni izdelki
-
Pokažiti.
Podrobnosti.
BASECUT 150mm Grip 15H P500, Quality 500, 100/Pack
-
Pokažiti.
Podrobnosti.
PROTECCION DCHA ACOPLAMIENTO G9X
-
Pokažiti.
Podrobnosti.
2CDS253001R0104 S203-C10 circuit breaker
-
Pokažiti.
Podrobnosti.
Rotorlock H200 rotor lock
-
Pokažiti.
Podrobnosti.
2CCS803901R0539 short-circuit current limiter, 3-pole, 32A
-
Pokažiti.
Podrobnosti.
1SDA013898R0001 clamp cover HOCH S5 4P