MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste
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Förfrågning om pris
BP20 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal.Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.Manufacturer: Hexion